IEC TR 61760-3-1-2022 Surface mounting technology - Part 3-1 Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surface printing .pdf
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IEC TR 61760-3-1-2022 Surface mounting technology - Part 3-1 Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design w
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IEC TR 61760-3-1-2022 Surface mounting technology - Part 3-1 Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surface printing .pdf
上传人:
LabRcc2450
创建日期:
2026-10-18
格式:
pdf
大小:
8.69MB
浏览量:
11
所需积分:
30
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